The Biden-Harris administration opened a funding competition for advanced packaging technologies projects of up to $1.6 billion through the CHIPS and Science Act on Oct. 18.
The competition was initially announced in July. It will help the U.S. establish and accelerate domestic advanced packaging through investments focused on five R&D areas with awards ranging from $10 million to $150 million over a five-year period, according to the notice of funding.
Equipment projects may receive the most funding
Additionally, the agency will reserve up to $50 million to support the winners’ prototyping activities that will be operated at the upcoming National Semiconductor Technology Center Prototyping and Advanced Packaging Piloting Facility. The piloting facility is expected to be announced later this year, Commerce Secretary Gina Raimondo said in the release. The piloting facility is expected to be announced later this year, Commerce Secretary Gina Raimondo said in the release.
“This ambitious funding opportunity is designed to fill key technology gaps in advanced packaging to ensure U.S. leadership in the global semiconductor ecosystem,” Laurie Locascio, director of the National Institute of Standards and Technology, said in a statement.
Concept papers are due Dec. 20, according to the notice of funding. The CHIPS Research and Development Office also hosted an in-person “Proposer’s Day” on Tuesday explaining each of the five R&D areas. The event will also give potential applicants the opportunity to network and form partnerships, according to the NIST website.
