Dive Brief:
- GlobalFoundries plans to build an advanced packaging and testing center in Malta, New York, the company announced Jan. 17.
- The chipmaker will invest $575 million in the facility, with $186 million dedicated to research and development over 10 years. The project will support 100 new full-time jobs, the press release stated.
- The center will be located in GlobalFoundries’ existing fab campus in New York, where it has invested $16 billion since 2011.
Dive Insight:
The expansion supports GlobalFoundries’ efforts to create a domestic end-to-end semiconductor solution, transforming chips into individual packages ready for end-product use. The U.S.-made chips, used in the defense, AI, automotive, aerospace and communications industries, aim to move packaging production away from Asia, according to the release.
The center will specialize in silicon photonic packaging, integrating optical and electrical components for efficiency and performance. GlobalFoundries is also adding production capabilities for the advanced packaging, wafer-to-wafer bonding, assembly and testing of 3D and HI chips, the release stated.
The facility will receive state and federal funding as well — $20 million from New York state, adding to a $550 million Green CHIPS program investment, as well as $75 million from the Department of Commerce under the CHIPS and Science Act.
The DOC also finalized another $1.5 billion award for the chipmaker under the CHIPS Act in November 2024, which will help triple the existing capacity of the Malta campus over the next 10 years.
GlobalFoundries’ New York presence consists of over 2,500 employees at the Malta facility. The fab is also a U.S. Trusted Foundry accredited fab, making chips for the Defense Department used in sensitive national security systems since 2023.
